This section describes reliability prediction of a integrated circuit dice mounted in a hybrid package. A hybrid is normally made up of one or more substrate assemblies mounted within a sealed package. Each substrate assembly contains of active and passive chips with thick or thin film metallization mounted on a substrate, which in turn may have multiple layers of metallization and dielectric on the surface.

 

To model the hybrid device in your product tree, you should:

1. Create Item in the product tree Family: Electronic, Item Code: Hybrid

(no special data needed on the method screen - this screen doesn't exists)

2. Under Hybrid create Substrate (Family: Electronic, Item Code: Substrate) and on the method specific screen enter all information about the substrate.

Note: under one Hybrid user may create more then one Substrate

3. Under Substrate add all components placed on this substrate.

 

See illustration below for a hybrid structure example: